Summary: Evercore ISI reiterates Outperform on LEU with $390 PT on Palantir AI partnership identifying $300MM+ cost savings; PLTR named as strategic beneficiary.

Centrus Energy $LEU reiterated at 'Outperform' at Evercore ISI, with a $390 price-target

Analyst Nicholas Amicucci comments on their new Palantir $PLTR partnership:

"Earlier this morning, Centrus continued it partnership announcement momentum as it announced a landmark strategic partnership with Palantir to deploy AI-driven software across its multibillion-dollar Piketon enrichment expansion, with early work already identifying nearly $300MM in potential cost savings since the recent agreement was signed in January, which is importantly is only “the tip of the iceberg.”

This followed the announcement of its EPC arrangement with Flour showcasing the companies continued “best-in-class” partnership initiative, which could also be complemented by the potential partnership with Oklo, and provides the company with an even stronger political capital “war chest” in our opinion.

From an investment perspective, this development is a rather significant incrementally positive to our long-term thesis. First, identifying ~$300MM of efficiencies at this early stage materially supports our view that disciplined project execution can protect returns through the buildout cycle, particularly as Centrus moves toward commercialscale deployment.

Second, the use of advanced analytics across project controls and manufacturing execution meaningfully reduces construction, schedule, and cost-overrun risk, which are all key toggle items that can have significant impacts around cascade timing and the capital intensity to achieve “Nth” of-a-kind Cascade builds.

Third, accelerating timelines for bringing new enrichment capacity online enhances Centrus’ ability to capture tightening SWU market fundamentals, especially against the backdrop of Russian supply constraints and rising Western demand. Under the agreement, Centrus will leverage Palantir’s Foundry and AIP platforms to integrate systems across classified and unclassified environments and optimize project controls, engineering, manufacturing execution, supply chain management, and regulatory compliance as it scales commercial enrichment capacity. We reiterate our Outperform rating."


Centrus continued it partnership announcement momentum as it announced a landmark strategic partnership with Palantir to deploy AI-driven software across its multibillion-dollar Piketon enrichment expansion

structural marker; pre-classified as canonical yfinance ticker


B. Riley raises Pangea Logistics $PANL price-target to $11.50 (from $9)

Summary: B. Riley raises PANL PT to $11.50 from $9; author shares/endorses the bullish call.


Summary: Bernstein reiterates Outperform on HOOD, PT $130, with above-consensus revenue/EPS estimates on crypto recovery and prediction markets growth.

ROBINHOOD $HOOD reiterated at 'Outperform' at Bernstein, with a $130 price-target, citing "asymmetric upside potential":

"We see an asymmetric upside potential in HOOD driven by recovery in crypto markets and breakout revenue growth in prediction markets. For 2026E, we are 9% ahead of consensus on revenue (16% ahead on EPS) driven by crypto recovery (31% ahead vs. consensus) and prediction markets (30% ahead vs. consensus on other transaction revenue). Similarly for 2027, we are 18% ahead of consensus on revenues (25% ahead on EPS), driven by crypto and prediction markets.

A weak Q1 print is already priced in HOOD’s >50% drawdown since Q4’25 and we expect the market to be forward looking, as trading volumes recover Q2 onwards. Structurally, HOOD has a long growth runway representing mere 4% of total broking revenue TAM, as it continues taking retail trading share (14% rev. share in 2025 vs. 11% in 2024 - including new asset classes - crypto, predictions) and grows its share of banking & advisory revenue pools through new product launches."


Summary: Bullish PLPC: author endorses and amplifies bullish thesis on grid-theme, low-float, profitable, insider-held compounder.

It is *extremely* rare to get this combination $PLPC

1) Pure play on hot theme (the grid)
2) Extremely low float
3) Profitable
4) Reasonable valuation
5) Growing
6) Tightly held by insiders & institutions
7) Hot chart with strong volume profile


Summary: Largest position in ENS; expects positive policy tailwinds ahead, bullish on the stock.

@thejefflutz $ENS is still my largest position so I believe that they will, at some point. I agree that it's a necessity, with or without the renewable focus.

@stocktalkweekly Back is against the wall... They've turned from negative to neutral on batteries over the past year in terms of rhetoric and policy (left IRA credits in the OBBB and obliterated everything else renewable).  I think they tick one more level in the direction of being pro US


Summary: BofA initiates NBIS at Buy with $150 PT (31% upside) on AI IaaS opportunity and GPU-dense platform positioning.

industry='Internet Content & Information'

NEBIUS $NBIS initiated at 'Buy' at Bank of America, with a $150 price-target:

"We are initiating coverage of Nebius with a Buy rating and a $150 price objective, implying 31% upside. Nebius operates in one of the fastest-growing segments of cloud computing, the AI Infrastructure-as-a-Service (IaaS) market.

By building and running large data centers, Nebius allows companies to train and run AI models without having to invest in their own infrastructure. This represents a huge opportunity.

Total IaaS TAM, including AI IaaS, is projected to surpass $419bn by 2028, driven by rapidly increasing model complexity and accelerating enterprise adoption of AI.

As one of the few purpose-built platforms designed specifically for GPU-dense distributed workloads, and a customer base that includes Microsoft and Meta, we believe Nebius is strategically positioned to capture share."


Summary: NVDA next-quarter guidance of $78B beats $72B estimate; author shares bullish print implying upside.

*NVIDIA GUIDES NEXT QUARTER REVENUE $78 BILLION VS. $72 BILLION EST.


Summary: Shares Jensen Huang's bullish demand forecast doubling to $1T through 2027; implicitly endorses long NVDA.

“Last year at GTC, I told you we saw $500 billion of demand thru 2026. Today, I see at least $1 trillion of demand thru 2027.” - Nvidia CEO Jensen Huang $NVDA https://t.co/RhXGO0sU0M


Summary: Evercore maintains Outperform and $330 PT on AAPL; no material strategy change expected under new CEO Ternus.

*EVERCORE COMMENTS ON NEW APPLE CEO JOHN TERNUS $AAPL

"AAPL announced after the close today that Tim Cook will step down as CEO this August, with John Ternus, the company’s current SVP of Hardware Engineering, set to take the role effective September 1, 2026. AAPL stock has done remarkably well under Tim Cook (+1,932% vs. S&P 500 up 504%) as he expanded the focus on not just product innovation but also on profitability and shareholder return. Key points from our chat with the company (CFO and IR) –

1) Succession planning has been going on for a while and AAPL board viewed this as an opportune time to execute the CEO transition given how well the company is doing though there is a realization that there is never a perfect time to do CEO transitions.

2) AAPL executive team largely knows and has worked with John Trenus over decades and folks are excited to see what he can do in the coming years (don’t see a retention issue post this).

3) Tim will become the Executive Chairman on 9/1 and will focus on policy and be a resource for John Trenus and AAPL executive team broadly.

4) Johhny Srouji takes over as the chief hardware engineer effective immediately. And with a Sept. 1 start date, John Ternus will now lead Apple’s fall launch cycle, which is expected to include new iPhone 18 Pro models as well as Apple’s first foldable phone. This should position him to own the next phase of major product launches, which we expect will also bring a broader set of Apple Intelligence features.

Coinciding with the CEO succession is a board transition, as Tim Cook will become Apple’s Executive Chairman following his departure as CEO, while current Chairman Arthur Levinson will transition to Lead Independent Director.

Net/Net: While executive changes at Apple are rare, we think the appointment of John Ternus as CEO makes sense given the company’s history of leadership rooted in the core hardware business, particularly the iPhone. We don’t expect any material change in Apple’s NT strategy, though we’re encouraged by the potential for new AI features, particularly alongside the next wave of product launches this fall. Maintain OP and $330 target."


Summary: Intel wins multi-year Google Xeon data center deal; author shares bullish news for INTC.

*INTEL AND GOOGLE ANNOUNCE MULTI-YEAR COLLABORATION ON AI COMPUTE -- INTEL WINS GOOGLE'S COMMITMENT TO USE XEON CHIPS IN DATA CENTERS $INTC $GOOGL


Summary: Holding ENS through earnings as largest position with large cushion.

@naturescarecd It's my largest position and I have an ENORMOUS cushion so... yes

@stocktalkweekly Are you holding ens thru earnings?


Nice report from $AMKR ... Top & bottom line beat with record revenue up +27% Y/Y. Strong guide with EPS $0.42-$0.52 (vs. $0.32) & revenue guide at $1.75-$1.85B (vs. $1.74B)

Summary: Bullish AMKR: earnings beat, record revenue +27% YoY, strong guidance above consensus; pullback seen as normal after parabolic run.

industry='Semiconductor Equipment & Materials'

Nice report from $AMKR

Stock has been parabolic, so pullback is totally normal. Top & bottom line beat with record revenue up +27% Y/Y. When we bought this stock, growth was muted. Strong guide with EPS $0.42-$0.52 (vs. $0.32) & revenue guide at $1.75-$1.85B (vs. $1.74B)

Amkor $AMKR

- Broadcom $AVGO is designing OpenAI chips
- Amkor won 2024 'Best Supplier Award' from Broadcom
- Amkor partnered with Taiwan Semi $TSM & Apple $AAPL to launch largest OSAT hub in the U.S. -- Apple to be first customer
- Trades under 1x sales
- Testing 200-week SMA https://t.co/1UqCCaTAOp


Summary: Bullish on VIAV following blowout earnings beat; implies durable strength.

Nice earnings for our new position $VIAV

Revenue: $299.1M vs. $275.3M est. +25.6% Y/Y
EPS: $0.15 vs. $0.11 est. +150% Y/Y

Great quote from the CEO on the synergy of Spirent:

"VIAVI's first quarter financial performance has exceeded our expectations. Strong demand from the data


Summary: ENS is author's largest position; reaffirms conviction in its resilience through drawdowns.

@Nerd_0ne Never does, largest position for a reason

@stocktalkweekly The drawdown didn't even touch $ENS  💪


Summary: Long GLDD as pure-play dredging beneficiary of US maritime policy upcycle; also holds HII for shipbuilding/naval expansion exposure.

Great Lakes Dredge & Dock $GLDD initiated at 'Overweight' at JP Morgan, with a $20 price-target:

"We initiate coverage of Great Lakes Dredge & Dock (GLDD) with an Overweight rating and a YE26 $20 price target, reflecting ~35% upside potential. Based on insights from our visit to GLDD’s Houston headquarters, we reaffirm that GLDD is the largest dredging contractor in the US, entering a multi-year upcycle driven by record government infrastructure spending, a $1B+ backlog, and expansion into offshore energy. We believe GLDD’s modernized fleet and offshore energy will support above-peer growth and margin expansion."

---

This is the thesis I shared on $GLDD with our subscribers on Jan 15th (one week before today's JP Morgan note -- ahead of the herd):

My current shipbuilding exposure is $HII which we've owned since early last year and has done very well for us (nearly doubled from low $200s to $400+). However, I want to increase my exposure to the shipbuilding and U.S. naval expansion phenomenon.

There is a tremendous amount of policy focus here and I don't think it's going away for the next few years, especially with the launch of the Trump-class battleship. A shipbuilding focus means more emphasis on domestic maritime capacity. In order to expand port infrastructure (deepening and/or widening of ports) & build waterways/channels for large ships, dredging activity is required.

Dredging is the underwater excavation and removal of sediment, silt, and debris from the bottom of water bodies like rivers, lakes, and harbors Warships have hard draft/underkeel-clearance constraints, and dredging is how you keep those access channels usable over time as sediment accumulates. It's difficult to find pure-play exposure to dredging, as there are not many options, but one I find compelling is Great Lakes Dredge & Dock $GLDD.

GLDD benefits from the Foreign Dredge Act / Jones Act regime, which significantly restricts foreign-built/foreign-operated vessels from competing in U.S. dredging and coastwise trades. GLDD is building Acadia, described as the first and only Jones Act–qualified SRI vessel being constructed in the U.S.

One of the risks is their offshore wind exposure (because Trump hates wind energy), but at only 7% of their total backlog, I think this risk is minimal/muted by the greater business.

Where's the direct policy linkage?

  Trump’s April 2025 executive order (“Restoring America’s Maritime Dominance”) is framed as a maritime-industrial-base program, not just shipyard grants.

The EO directs an assessment of investment options to expand the “Maritime Industrial Base,” explicitly including port infrastructure and maritime port access, alongside shipbuilding and ship repair.

More funding/priority for federal navigation O&M (maintenance dredging) through the HMTF pathway

More political urgency for capital deepening/widening at strategic ports/shipyard approaches (general-fund + cost-share projects), because bigger commercial and naval vessels force the issue.


Summary: Bullish IRDM; endorses continued relative strength driven by BVLOS FAA waiver and PNT ASIC catalyst into mid-2026.

$IRDM momentum in BVLOS (First FAA Waiver for Commercial Operations) and PNT (new PNT ASIC planned for mid-2026) likely continue to contribute to the relative strength that this name has enjoyed. https://t.co/Fj8YmigHly

$IRDM dual-theme exposure to space & drones (BVLOS for remote command & control and PNT to mitigate GNSS jamming) trading at 6x P/FCF and 8x EV/EBITDA

Chart showing signs of bottoming, with reclaim of 9/21EMAs and 50SMA on favorable volume.

Break over $20 can be explosive. https://t.co/70EdCzg5NT


Summary: FDA approves Lilly's oral GLP-1 weight loss pill Foundayo; author shares bullish catalyst for LLY.

*FDA APPROVES ELI LILLY'S GLP-1 WEIGHT LOSS PILL 'FOUNDAYO'

*BEGINS SHIPPING APRIL 6TH

*PRICING AT $25 PER MONTH WITH INSURANCE OR $149-$349 OUT OF POCKET $LLY


Summary: Long MITK: all-in-one identity/fraud platform at 12x forward P/E, 0.60 PEG, with AI-fraud tailwind and dominant check-deposit distribution moat.

The stock I shared with our community members on Feb 25th was Mitek $MITK

I think it is one of the most compelling SMID caps on the market at current valuations.

This is the simple thesis I shared:

Mitek’s Q1 FY26 investor presentation frames their core investment thesis clearly: fraud is entering a new phase where AI-generated synthetic identities and deepfakes are outpacing legacy controls, and enterprises increasingly need accurate, multi-signal decisioning across onboarding, authentication, and transaction risk, rather than stitching together fragmented point tools from multiple vendors.

Mitek’s claim to win this shift is that its Verified Identity Platform (MiVIP) unifies identity verification, authentication, liveness/deepfake detection, and advanced fraud analytics in a single workflow, while still operating a mission‑critical check platform at scale. In layman's terms: Mitek is positioning itself as an all-in-one reality check for digital interactions, proving a person and their credentials are real even when attackers can generate convincing fakes.

Fraud & Identity Solutions is now the growth engine and is overtaking the legacy Check Verification business. In Q1 FY26, total revenue was about $44M (+19% YoY), with Fraud & Identity Solutions at ~$25M (+30% YoY) versus Check Verification at ~$19M (+6% YoY), meaning Fraud & Identity is larger than Check in the quarter. On a trailing‑twelve‑month basis, the deck shows Fraud & Identity at $96M vs. Check at $91M, 51% vs. 49% of LTM revenue, explicitly crossing the majority threshold.

Nonetheless, it is worth noting that the Check Verification business process 1.2B transaction each year, and has upwards of 99% market share, giving it strong pricing power if volumes wane.

Mitek’s biometrics stack (acquired from ID R&D) includes IDLive Face (passive face liveness to detect presentation and injection attacks), IDLive Doc (document liveness), and IDLive Voice (anti‑spoofing voice liveness, it also added voice-clone detection that can score the likelihood speech was generated by cloning technology from only a few seconds of audio), and its site explicitly categorizes “deepfake attack” and “injection attack” as fraud types it addresses.

It’s not just matching your selfie to your ID, it’s trying to prove you’re a live human and not a replay, a mask, or an AI-injected video feed.

The distribution/customer access angle is one of Mitek’s most underappreciated differentiators versus many identity point-solution vendors. The investor presentation states its technology supports more than one billion mobile deposits annually, which implies it is already deeply embedded in high-volume banking workflows, and outside the deck, Mitek has publicly stated that it is trusted by thousands of organizations and that the majority of North American financial institutions rely on its mobile check deposit solutions. That legacy footprint isn’t just old revenue, it is a distribution rail: it provides executive relationships, procurement paths, and operational trust inside highly regulated customers who are now being forced to upgrade defenses against AI-driven fraud.

Mitek isn’t just saying “we can tell if an image looks fake.” They sell tools that try to answer: 1) Is this a real person in front of a camera right now (not a photo/video/deepfake)?  2) Is the camera feed authentic, or is someone secretly feeding fake video/images into the app?  3) Is this ID document real and physically present, or just shown on a screen / tampered?  4) Is this voice real, or a voice clone made by AI?

The stock is very reasonably priced for a growing small-cap trading at 12 forward P/E, 0.60 PEG ratio, 11x free cash flow, and 15x EV/EBITDA.

New position opened in small cap stock in new thematic basket at https://t.co/NbEwQ4ZHLH


Summary: Shares Rosenblatt Buy on SYNA with PT raised to $125; top long idea for 2026 on IoT/edge AI growth and design wins.

Rosenblatt raises $SYNA price-target to $125 (from $95)

"Synaptics turned in a beat-and-raise quarter led by 53% Y/Y growth in its Core IoT business. We believe the wireless connectivity products are enjoying growth from both new design wins and an upgrade cycle. Management cited multiple new MCU and microprocessor design wins and opportunities. We like Synaptics’ portfolio position for these markets. SYNA remains our top long idea for 2026. We are increasing our price target to $125, up from $95.

The combination of embedded processors plus wireless connectivity is a very powerful solution for customers designing network edge and physical AI products.  Management reiterated Astra remains on track for meaningful revenue contribution beginning in CY27 and expects it to be gross margin accretive, supported by continued customer engagement (including robotics/humanoids sampling and Tier-1 CE design wins for vision-based smart TV gesture control).

We see this as an underappreciated acquisition candidate for SLAB given the strength of edge wireless connectivity technology. We view Synaptics as the market leader in network edge wireless connectivity based on ~50% annual growth, broad base of wireless technologies, and leadership edge."

The on-device inference stock I shared with our community members on Wednesday was Synaptics $SYNA

This is the thesis I shared:

In my view, one of the biggest themes of this year will be Edge Compute & On-Device Inference.

Currently, the only position in my portfolio that


Summary: Added to SYNA position today; ongoing bullish stance.

@stocktalkweekly Thoughts on SYNA price action this week?


Summary: Endorses long equity position in NBIS, calling it a gift that keeps giving.

@Maximus_Holla Same my friend, the gift that keeps on giving

https://t.co/VJuE1BulNd

$NBIS
in equity only for me! https://t.co/CMo6gm66wH


Summary: Shares Jensen Huang's bullish disclosure that $1T backlog covers only Blackwell/Vera Rubin through 2027, excluding other product lines.

The $1 trillion number I shared is only for Blackwell and Vera Rubin, and that's what we have in the backlog today thru 2027. That figure does not include our other GPUs or CPU business or Groq or storage or our many other products. - Nvidia $NVDA CEO Jensen Huang in Q&A session https://t.co/aVjDyROdw7


Summary: Holds full long position in OSS since $4.71, no shares sold.

@Jelitics Welcome to the party big dawg. Long since $4.71, haven't sold a share.

Initiated a $1,060,000 position in $OSS (100,000 shares). https://t.co/bVtu4ZSo2Q


Summary: Shares Jensen Huang's bullish Vera Rubin demand thesis: 99% incremental vs. Blackwell, replacement demand negligible for a decade.

Vera Rubin sales will be 99% incremental growth vs. previous generation Blackwell. Replacement demand will not be significant vs. incremental demand until a decade from now. - Nvidia CEO Jensen Huang in press Q&A $NVDA


Summary: Shares BofA Buy/$460 PT on TSLA; early-stage autonomy monetization via robotaxi as next mobility era catalyst.

*BANK OF AMERICA SAYS TESLA IS IN EARLY INNINGS OF AUTONOMY MONETIZATION $TSLA

"We maintain our Buy & $460 PO as we see significant embedded opportunity from robotaxi, and believe TSLA is at the early stages of monetization of its autonomy capabilities. We see autonomous vehicles spurring the next era of mobility and as the most significant change agent in the Auto 2.0 landscape, offering consumers the prospect of saving time, safer travel, and more accessible transportation."


Summary: Long BLDP via August calls; bullish on hydrogen fuel-cell datacenter play with compelling chart setup, 2.3x cash valuation, and Microsoft/Caterpillar validation.

The "unusual flow" that many of you saw on Ballard Power $BLDP last week on May 15th, was us. The stock is breaking over $5 today, and our $5 calls for August are already up +130%

This is the thesis I shared with our members on 5/15, highlighting Ballard Power's datacenter validation at Microsoft $MSFT Cheyenne, Wyoming datacenter:

OVERVIEW: I believe this is one of the most compelling charts on the entire market and also one of the most compelling sympathy trades, as one of the only peers to both Bloom Energy $BE and FuelCell $FCEL, which have both been parabolic stocks.

Ballard is a high-optionality hydrogen fuel-cell platform with a unusually strong cash balance for its size, improving gross margins, and credible OEM relationships in buses, rail, marine, and stationary/data-center power.  In the last earnings call, Ballard's CEO Marty Neese explicitly said that the data center opportunity is an area of deep exploration for the company and they plan to pivot into it going forward.

Diesel generators face emissions, permitting, noise, and runtime concerns. Data-center operators still need reliable backup power. Hydrogen fuel cells can provide zero on-site emissions.

Ballard’s data centers use case shines where PEM fuel cells can support reduced time-to-power, backup power, complementary power, rapid ramping, cycling flexibility, reliability, low noise, and modular multi-MW deployment.  The company has a real business and trades at just 2.3x cash and 2x book with revenues +26% Y/Y. But more importantly, the technical picture has an extremely powerful setup, and in light of the recent BE sympathy bidding behind FCEL lately, there is a legitimate angle here.

It's also worth noting that while the market is currently pumping FCEL as the BE sympathy, BLDP & FCEL have basically the same EV/sales multiple while BLDP is currently reporting a POSITIVE consolidated gross margin (9%), while FCEL is reporting a NEGATIVE consolidated gross margin (-16%).

TECHNICAL PICTURE: On the daily, $BLDP is flagging retesting the breakout from a 9-month base. On the weekly, the stock has aggressively broken thru the 200-week moving average for the first time since 2022 (when it was trading $12+). On the monthly, the stock is pushing into the flat 200-month moving average overhead with the 9&21-month EMAs curling up below price. This is a drop-dead gorgeous chart and I think one of the nicest SMID cap charts in the entire market.

TECHNOLOGY VALIDATION: Ballard and Vertiv $VRT one of the nation's biggest power & cooling infrastructure players in the datacenter theme (a $144 billion market cap) announced a strategic technology partnership in June 2024 focused on backup power for data centers and critical infrastructure. The initial solution integrated Ballard fuel-cell power modules with Vertiv’s Liebert EXL S1 UPS platform at Vertiv’s Ohio facility. The system was designed to scale from 200 kW to multiple megawatts.

In the North American market as a validation of their fuel cell engines, Ballard announced a commercial agreement with New Flyer for 500 FCmove-HD+ fuel cell engines, totaling 50 MW. Deliveries are expected to begin in 2026, and the engines will power New Flyer’s Xcelsior CHARGE FC hydrogen fuel cell buses across North America. Ballard said this is New Flyer’s largest single commitment since the partnership began, and the relationship spans more than a decade.

In January of this year, they announced perhaps their biggest validation ever: Caterpillar, in collaboration with Microsoft and Ballard Power Systems, was recognized for its work in datacenter hydrogen fuel cell technology, winning the ‘Systems Development and Integration’ award at the U.S. DOE's Hydrogen Program Merit Review Awards.

The Ballard Power Systems-supported project successfully demonstrated its megawatt-scale fuel cell platform at Microsoft’s Cheyenne, Wyoming, data center. The 1.5MW fuel cell and battery microgrid solution showed increased resiliency and lower carbon intensity, providing applicability beyond standby, over a simulated 48-hour outage.

I've filled an equal position in both the $4C @$0.90 and $5C @$0.60 for August expiration

Another new position, 2nd of the day, opened at https://t.co/2FUgR3izu2 in datacenter energy infrastructure stock trading at just 2x cash...


Filled full position @ $12.91 avg. The stock is extremely undervalued. The company trades at less than 2x cash. Yes, less than 2 times CASH with ZERO DEBT. 10x forward P/E and 12x EV/EBITDA. Dirt cheap vs. peers.

Summary: Long RDCM at $12.91: trades <2x cash, zero debt, 10x fwd P/E, 75% gross margins, double-digit growth, activist pressure for strategic review/sale.

Back on April 23rd, I shared a thesis with our community members on a new position Radcom $RDCM

This is the note I shared:

RADCOM $RDCM - RDCM is a legitimate niche telecom software/assurance company. The bull case is straightforward: high gross margins, very low capex, a fortress balance sheet, with major industry names tied in as customers.

RADCOM sells cloud-native telecom assurance, observability, and analytics software to communications service providers. Its core platform, RADCOM ACE is an automated, cloud-native assurance platform for 3G/4G/5G that provides end-to-end visibility from RAN to core, real-time troubleshooting, anomaly detection, and closed-loop analytics.

RDCM sits in an interesting niche as a network assurance & observability player that is a peer to VIAV (current largest position) and NTCT (former position that did very well, and held up very well) in many ways: same buyer, same budget line, same operational problem. RADCOM’s own 2026 20-F explicitly names VIAVI and NETSCOUT among its principal competitors.

RDCM is insulated from AI vs. software fears (just like its peers VIAV and NTCT have been for months) because it is not selling generic horizontal workflow software whose primary value is that somebody once encoded a common business process into an app. The practical moat is not “we can write code”; it is “we can acquire, normalize, correlate, and operationalize telecom network data in real time at carrier scale.” the strongest defenses against AI displacement are proprietary data and deep embedding in customer workflows. RADCOM has both.

Stock avoids China exposure appropriately. Revenue from U.S. is 54%, and revenue from EMEA (Europe, Middle East, Africa) is 31% meaning 85% of revenue is ex-Asia.

Partner & customer ecosystem is extremely robust for a small-cap: AWS, Google Cloud, Microsoft Azure, NVIDIA, AT&T, Rakuten Mobile / Rakuten Symphony, and DISH / EchoStar...  An early AI angle is emerging with RADCOM AIM / NetTalk / Neura. AIM applies AI/ML for anomaly detection, baselining, prediction, and zero-touch automation. NetTalk and Neura extend that into generative/agentic interfaces on top of RADCOM’s data.

Here's the most compelling part: The stock is extremely undervalued. The company trades at less than 2x cash. Yes, less than 2 times CASH with ZERO DEBT. 10x forward P/E and 12x EV/EBITDA. Dirt cheap vs. peers. Meanwhile, the company runs 75% gross margins and 17% net margins while being profitable on GAAP net income, operating income, and free-cash-flow measures. They are also growing double-digits top and bottom line as well with revenue +17% TTM and EPS +69% TTM...

Activists who see the value are circling lately... 'Lynrock Lake' is at 20% ownership and has been pushing for a strategic review and sale of the business. 'Value Base' is at 5.4% ownership targeting a reshaping of the board. Value Base has scheduled a special meeting for this purpose on May 20, 2026.

Technically, the stock looks ready to move. Today it is breaking over the 200-day and 50-week moving averages simultaneously.  This is an extremely high-quality business with a compelling value case to boot. At this market cap range, that is very very very rare.

The biggest risk is very high customer concentration. In 2025, customer A was 48% of revenue, customer B was 17%, and customer C was 21%. The top three customers were 86% combined.

Filled full position @ $12.91 avg.

New position opened at https://t.co/NbEwQ4ZHLH

Compelling small-cap trading at less than 2x CASH with no debt...


We're up about +45% on those contracts already. Looking forward to more juice.

Summary: Holds BB $6 Sept calls, up 45%, expects further upside.

The $BB $6 calls that many of you saw on your favorite flow tracking accounts last week, was us 😉

We’re up about +45% on those contracts already. Looking forward to more juice. https://t.co/UfCvFDwEyx

$BB 10000 of the Sept 6c traded here https://t.co/HA29X7KN0O


Summary: Long MITK: FICO marketplace partnership overlooked, rare high-purity SMID cap play on AI fraud growth.

Mitek $MITK FICO marketplace distribution partnership from last week went overlooked... Eventually the market will catch on to the significance... AI fraud is becoming a bigger problem every day, and there are very few high-purity SMID cap public exposures to play it...

The stock I shared with our community members on Feb 25th was Mitek $MITK

I think it is one of the most compelling SMID caps on the market at current valuations.

This is the simple thesis I shared:

Mitek’s Q1 FY26 investor presentation frames their core investment thesis


Summary: Confirms long position in ADEA, endorsing the parent's bullish find.

@geokoutalidis @pennycheck We’re long as well 🫡

Hidden gem! $ADEA

Such a great find from @pennycheck


Summary: Shares DA Davidson initiation of BDC with Buy rating and $155 PT on Ruckus acquisition, industrial reshoring, and 2028 EPS target.

DA Davidson out this morning with a $155 PT on Belden $BDC , citing the RUCKUS acquisition as well:

"We are initiating coverage of BDC with a ‘BUY’ rating and a $155 price target, which reflects roughly 11x our pro forma CY27 adj. EBITDA forecast of $730M. We see BDC as well positioned to benefit from industrial reshoring and recapitalization, increasing automation investment, IT/OT convergence, and rising networking demands.

While elevated leverage near term presents a headwind, BDC appears poised to execute on its $11 EPS goal for 2028 led by the pending Ruckus acquisition. Aided by increasing margins and earnings power, BDC should also see multiple expansion narrow the gap with key peers."

On HPE's earnings, they cited that Wi-Fi 7 sales were up +600% due to network modernization.

One of their closest direct, Tier 1 Wi-Fi 7 peers is RUCKUS Networks, who sells Wi-Fi 7 APs led by R770.

Belden $BDC agreed to acquire RUCKUS from Vistance on Apr 29 of this year...


Summary: Still holding ENS as 4th-largest position after doubling from $112 entry; ongoing long conviction.

EnerSys $ENS has now more than doubled since I shared my high-conviction thesis @ $112. Still sits in the portfolio as our 4th largest position.

EnerSys $ENS - Profitable, undercover U.S.-based battery play trading at 1x sales and 11 P/E

Every other battery stock is trading at premium valuations based on hype & speculation about their technologies, and the domestic battery supply theme is gaining steam with China most https://t.co/GHQvBkuWvx


Summary: Staying long VPG at full size and planning to exercise calls; endorses best-quality small-cap Physical AI thesis.

industry='Scientific & Technical Instruments'

@ThematicTrader Agreed, has acted that way for sure. Staying long full size and likely exercising my $50C and $60C I bought when the stock was ~ $53

$VPG I continue to believe this is the best quality & strongest small cap Physical AI stock in the market. https://t.co/rUcxcF1ndp


Summary: Bullish on MITK after report; calls it excellent and urges patience.

@skkxvkgkodcl12 I thought it was excellent. Patience padawan.

@stocktalkweekly What did you think of $MITK report?


it's been a top 5 weighted position for me greater than 10% of my net worth every single week since November of last year

Summary: Defends OSS as a high-quality, high-growth compounder; held as top-5 position >10% of net worth since November.

Yeah so… This is a bad take. I share a full portfolio with 29 position, and mostly a SMID cap focus on high quality compounders with clean balance sheets and high growth. I share weekly portfolio updates and it’s been a top 5 weighted position for me greater than 10% of my net worth every single week since November of last year. It’s not some risky shitco if you did your research. Cheers. 🍻

Seeing Lots of people mention $OSS and yes a great move and an awesome chart.

But how much of your account are you willing to put into a $400 million dollar market cap?

It’s an AI theme performance enhancer. Good for quick trades.

Can make a huge move but there is added risk


That creates genuine asymmetry for ADEA equity. If hybrid bonding becomes standard not only in NAND but also more broadly in HBM, AI accelerators, and logic chips... Adeia does not need dozens of wins for the semiconductor segment to become strategically important. It only needs a handful of large, recurring deals.

Summary: Long ADEA: deep hybrid-bonding IP moat (ZiBond/DBI/DBI Ultra) across memory, logic & AI chips creates asymmetric upside as HBM4/5 ramp drives licensing leverage with blue-chip roster renewing 2027+.

HYBRID BONDING, AND THE HIDDEN VALUE OF ADEIA'S $ADEA IP PORTFOLIO

WHAT IS HYBRID BONDING, AND WHY IS IT IMPORTANT?

We’ll kick this off with a layman’s explanation: Imagine a chip as a tiny city. The transistors are the buildings, and the metal wires are the roads. Historically, when chipmakers wanted to stack one chip on top of another, they connected them with tiny solder balls, like using little metal pillars between two floors of a building.

Hybrid bonding removes most of those pillars. Instead, it makes the two chip surfaces extremely flat and clean, bonding them directly together:

1. Oxide-to-oxide bonding: the insulating surfaces stick together
2. Copper-to-copper bonding: tiny copper pads line up and directly connect electrically

Instead of two chips being connected by relatively large solder bumps, they are fused together with extremely small copper pads.

Hybrid bonding lets chipmakers put memory and logic closer together, with many more tiny electrical doors between them. The result is a much tighter, shorter, denser connection between chips.

Hybrid bonding supports 4 things that chips desperately need:

Bandwidth - AI chips need to move huge amounts of data between memory & compute

Power - Moving data burns a lot of energy. Shorter wires reduce energy per bit.

Latency - AI inference benefits from faster memory access.

Package size - AI accelerator systems are already enormous. Hybrid bonding saves space.

This is becoming increasingly important in the AI age, because AI workloads are constrained not just by compute, but by memory. Large models require constant movement of weights and cache data. Even if the GPU is extremely powerful, that power can be underutilized if memory cannot feed it fast enough.

This is why memory is the key opportunity for hybrid bonding.

HBM is a stack of DRAM dies. Today, those dies are commonly connected using through-silicon vias (TSVs) and thermocompression bonding methods. It works, but it becomes harder as HBM stacks get bigger, faster, and more power-dense.

The industry is pushing from HBM3E, to HBM4 in 2027, and eventually HBM5.

Micron said its HBM4 uses a 2048-bit interface, delivers more than 2.0 TB/s per memory stack, and offers over 20% better power efficiency versus its prior-generation HBM3E products. A wider interface means more parallel data lanes between memory and the AI processor. But, wider interfaces create packaging pressure: more wires & more contacts, and more routing complexity.

Hybrid bonding helps because it can create far denser interconnects than solder-bumps can. SK Hynix has also disclosed that, for 16-stack HBM4, it is developing its MR-MUF packaging technology in parallel with hybrid bonding.

Other, independent industry signals support this trend:

TSMC’s SoIC page describes sub-10-micron bond pitch, high-density die-to-die interconnect, smaller form factor, higher bandwidth, better power and signal integrity, lower power, and 3D integration of homogeneous and heterogeneous chips. These are direct references to hybrid bonding's advantages.

Applied Materials $AMAT introduced an integrated die-to-wafer hybrid-bonding system in 2025 and framed hybrid bonding as a route to higher-performance, lower-power advanced logic and memory chips for AI computing.

Semiconductor Engineering described hybrid bonding as a major enabler of 3D integration, with orders-of-magnitude more interconnect density than solder bumps, and cited Yole Group’s forecast for hybrid-bonding equipment to grow at a 21% CAGR from 2025 to 2030.

The AMD 3D V-Cache example is the cleanest real-world proof point. AMD’s own technical brief says EPYC processors with 3D V-Cache use a copper-to-copper hybrid-bonding “bumpless” chip-on-wafer process, enabling more than 200x the interconnect density of 2D technologies and more than 15x the interconnect density of other solder-bump 3D technologies.

ADEIA’S HYBRID-BONDING STACK: ZIBOND, DBI, AND DBI ULTRA

Adeia’s hybrid-bonding stack is built around three branded ideas.

ZiBond is the low-temperature, direct-bonding layer aka any homogenous oxide-to-oxide bonding or like-material bonding at room temperature or modest temperatures

DBI adds the electrical interconnect. It's a low-temperature hybrid direct-bonding approach that bonds dielectric regions, while simultaneously enabling extremely fine-pitch metal-to-metal connection

DBI Ultra extends that to die-to-wafer and die-to-die use cases aimed at heterogeneous integration, tall memory stacks, and logic-memory combinations. DBI Ultra matters because high-value AI, HPC, GPU, CPU, and HBM products often need known-good die assembly, rather than pure wafer-to-wafer bonding.

(For those who don't know, known-good die (KGD) is an unpackaged semiconductor chip (die) that has been tested to be fully functional & reliable before being integrated into a final package).

Adeia says DBI Ultra can be used for different die sizes, process nodes, wafer sizes, and known-good dies, and that it scales toward 1-micron pitch. In their investor materials, the company explicitly points to use cases including HBM stacks, memory plus CPU / GPU / FPGA / SoC integration & data centers.

This full-stack is important because it shows that Adeia’s IP is not confined to one subsegment such as CIS wafer bonding. The IP portfolio reaches into the die-to-wafer flows that matter for HBM, logic chips & photonics.

WHAT ADEIA OWNS

Adeia’s semiconductor IP is broader than just “bond two chips together.” The relevant portfolio appears to cover at least six layers of the stack.

LAYER 1 - bonding mechanics and interfaces. DBI involves dielectric and metal bonding surfaces, copper or nickel pads recessed via CMP / dishing, spontaneous dielectric bonding at room temperature, and later annealing so that metal expands into a bonded interconnect. That gives Adeia patents around surface preparation, dielectric bonding, direct metal bonding, low-temperature anneal, metal pad geometry, and interface reliability.

LAYER 2 - assembly modality. Adeia has IP around wafer-to-wafer, die-to-wafer, and die-to-die bonding. Wafer-to-wafer is useful for image sensors, RF, and some 3D NAND-style use cases; die-to-wafer and die-to-die are more relevant when chipmakers need known-good dies, larger die, heterogeneous nodes, or expensive compute & memory stacks.

LAYER 3 - process-flow know-how. Adeia repeatedly distinguishes patent licenses from technology transfer. LAPIS / ROHM received DBI Ultra die-to-wafer hybrid-bonding know-how plus a license to Adeia’s foundational hybrid-bonding patent portfolio. The 2018 UMC partnership said wafer-to-wafer and die-to-wafer implementations would be used across image sensors, RF, MEMS, SoCs, analog, power, and mixed-signal devices. SK hynix received a DBI Ultra technology transfer for next-generation memory. Hamamatsu’s 2024 license history includes DBI wafer-to-wafer, ZiBond wafer-to-wafer, and a prior DBI Ultra technology transfer. This proves that Adeia’s value proposition is not only paper patents, but process recipes, integration know-how, and manufacturing expertise.

LAYER 4 - device architecture. Some Adeia patents are not merely “how to bond”. They claim system-level 3D processor structures, cache-over-core / memory-over-logic buses, pitch limits, and dense z-axis interconnect architectures. This is strategically more valuable because it can read on product architecture, even if the bonding operation itself is performed by a foundry.

LAYER 5 - adjacency into thermal management. Adeia is pushing RapidCool as a thermal-management extension based on its hybrid-bonding / advanced-packaging expertise. Q2 2025 materials said RapidCool can reduce thermal resistance by more than 70% versus traditional approaches and cool up to 3 W/mm, and Q1 2026 commentary said the company had improved that to about 5 W/mm. This is not the core hybrid-bonding royalty thesis, but it is directionally important because 3D stacks create heat-density problems that can constrain adoption. This is an extremely relevant and material IP adjacency.

LAYER 6 - portfolio scale. Adeia has become more explicit about portfolio size. In a 2025 technical discussion, Adeia said its bonding portfolio included more than 1,100 active patent assets spanning materials, processes, chemistries, IC structures, and system architectures. These numbers are consistent with the breadth shown by the AMD asserted patents.

WHAT MAKES THE ADEA IP PORTFOLIO ESPECIALLY VALUABLE

Adeia’s strongest portfolio attribute is coverage layering. A narrow patent portfolio around only one step, such as copper pad bonding, would be easier to design around.

Adeia’s public materials and asserted patents cover surface preparation, probe-damage mitigation, protective-material flows, annealing, diffusion barriers, different pad profiles & pitches, TSV-to-pad interface layouts, and 3D processor architecture. That breadth increases the odds that at least one patent family reads on a given high-volume implementation.

In FTO (freedom to operate) terms, this is more compelling than a single famous foundational patent. A non-licensee deploying modern bumpless copper dielectric hybrid bonding can potentially step on more than one class of claim at once: foundational direct-bonding chemistry, bonding-surface preparation, post-CMP conditioning, copper barrier and pad metallurgy, TSV / pad interface topology, die handling or carrier debond flows, and sometimes a product claim on the finished stack. A design-around at one step can still leave exposure somewhere else in the manufacturing chain or final product.

The current commercial moat is more heavily carried by live patent families from roughly 2015 onward, especially conductive-barrier direct hybrid bonding, surface-preparation and post-CMP treatment, TSV / pad topologies, profile / pitch accommodation at the bonding interface, probe-pad damage mitigation, and product / device claims such as a 3D processor with stacked cache linked by hybrid bonds. Those live families generally run into the 2035–2044 period.

The licensee roster is unusually strong for a small-cap IP company. Micron, SK hynix, AMD, UMC, Kioxia, Western Digital / SanDisk, Qorvo, Hamamatsu, and ROHM / LAPIS are not speculative startups.

The patent estate sits where the industry’s bottleneck is moving. Historically, Moore’s Law delivered scaling through front-end transistor shrink. Now performance scaling increasingly requires 2.5D / 3D integration, HBM, cache stacking, and advanced packaging. Adeia’s 10-K explicitly frames its semiconductor portfolio around hybrid bonding, advanced nodes, and packaging.

In layman's terms: Adeia’s moat is strongest not because it invented only one way to stick two chips together, but because its patents cover many of the hard things that make hybrid bonding actually manufacturable at high yield. A company can try to design around one claim, but it is harder to design around surface prep, post-CMP quality, pad layout, barrier materials, die handling, and product structure all at once. Most, if not all, companies pursuing hybrid bonding are likely to run into Adeia's patents.

Worth noting: Adeia says approximately 80% of its combined patent portfolio came from internal innovation. That is important. A pure patent aggregator can be more vulnerable to accusations that it merely buys and litigates. Adeia has a stronger argument that it is a long-term R&D organization that creates valuable technology.  The company runs beautiful profitability metrics with 87% gross margins, 47% operating margins, and 27% net margins.

THE BLUE-CHIP LICENSEE MAP

Adeia has already converted hybrid bonding from a technical portfolio, into a formidable licensing franchise. The memory agreements are long-standing and still active, while many of the AI logic agreements have been activated or renewed as of this year.

Memory and storage

Micron $MU (2022, ongoing) — Adeia / Xperi announced a multi-year agreement giving Micron access to Adeia hybrid-bonding IP for next-generation memory. The release framed Adeia’s portfolio as covering hybrid bonding, semiconductor packaging, and processing. In a Q1 2022 filing, Xperi said the Micron agreement meant Adeia had more than 90% of the DRAM memory market under license.

SK hynix (2020, ongoing) — SK hynix received access to broad semiconductor IP and a DBI Ultra technology transfer focused on next-generation memory. The release described DBI Ultra as patented die-to-wafer hybrid-bonding 3D interconnect technology.

Kioxia (2023, ongoing) — Kioxia signed a long-term agreement to license Adeia’s semiconductor patent portfolio, including hybrid-bonding patents.

SanDisk / Western Digital $SNDK $WDC (2023, still active) — Western Digital signed a long-term agreement to license Adeia’s semiconductor portfolio including hybrid-bonding patents. Adeia later highlighted SanDisk as a landmark license agreement under prior CEO Paul Davis.

It is worth noting that Adeia's licenses with Micron & SK Hynix come up for renewal in 2027, where Adeia's hybrid bonding portfolio will have more leverage because the ramp in HBM4 memory is expected to start around the same time. Their intellectual property will become even more critical for these endeavors.

Logic, foundry, RF, sensors, and broader semiconductor applications

$AMD (2026, ongoing) — Adeia announced a new multi-year IP license with AMD for access to its comprehensive semiconductor IP portfolio, resolving all litigation. Adeia’s Q1 2026 release says the license included hybrid bonding.

$UMC (2026, ongoing) — Adeia expanded and renewed its IP licensing relationship with UMC, including continued access to Adeia’s semiconductor portfolio and hybrid bonding. UMC referenced chips demand driven by AI, networking, and automotive, and said it had leveraged Adeia partnership for 3D integration of RFSOI wafers. This constitutes foundry-level validation.

Qorvo $QRVO (2023, ongoing) — Qorvo licensed Adeia’s hybrid-bonding technology for RF front-end semiconductor devices and modules. This shows the portfolio stretches past just memory and HPC to RF front-end modules.

LAPIS / ROHM (2022, ongoing) — LAPIS signed a deal that included a technology transfer of DBI Ultra die-to-wafer hybrid-bonding know-how and a license to Adeia’s “foundational hybrid bonding patent portfolio.” This validates custom LSI / ASIC use cases

Hamamatsu Photonics (2024, ongoing) — Hamamatsu’s 2024 agreement covered die-to-wafer hybrid bonding and supplemented pre-existing licenses to DBI wafer-to-wafer hybrid bonding and ZiBond wafer-to-wafer direct bonding.

STMicroelectronics $STM (2025, ongoing) — Q2 2025 materials say STMicro signed a new multi-year license for access to Adeia’s semiconductor portfolio. The public slide does not explicitly say “hybrid bonding,” so this should be classified as a semiconductor portfolio license, not a confirmed hybrid-bonding-specific license.

It is also worth noting that recently, on May 12 of this year, Adeia renewed its multi-year IP license agreement with Google, extending a business relationship that began in 2012. While this relationship is related to their media IP portfolio, in Rosenblatt's most recent report about ADEA (buy, PT $40) they said they see $100M in semiconductor revenue "in sight" and specifically cited an potential expansion of its relationship with Google and "other hyperscaler data center companies" with respect to its semiconductor portfolio.

THE AMD LAWSUIT AND WHY IT IS SO IMPORTANT

Adeia announced in March 2026 that AMD entered a multi-year license to Adeia’s semiconductor IP portfolio after settlement of their patent litigation lawsuit. On the May 2026 earnings call, management called AMD “one of our first licensees in the logic space” said the agreement was “very meaningful” and disclosed that AMD was a greater-than-10% customer in the quarter, although that included retroactive license fees.

The AMD outcome is strategically significant for four reasons.

First, AMD is a credible reference licensee. Adeia’s Q1 2026 call described the AMD license as a milestone and connected it to AMD’s chips architecture and hybrid bonding. AMD’s own technical materials establish that 3D V-Cache uses copper-to-copper hybrid bonding, so this is not an abstract license.

Second, the settlement happened quickly. Adeia sued in November 2025, filed an ITC complaint later that month, and announced the AMD license in March 2026. The quick resolution suggests AMD found settlement more attractive than prolonged litigation likely because Adeia's patent case was very strong.

Third, the AMD dispute gave investors visibility into specific patent numbers and technical theories. Most Adeia licenses are private, so the AMD suit provided a rare window into what Adeia believes is enforceable against leading-edge hybrid-bonded products. The AMD complaints illustrate Adeia’s coverage-layering strategy. It did not rely on one patent, but on a robust set of patents across bonded structures, stacked dies, specific 3D processor structures, and adjacent process-nodes & interconnects.

Fourth, AMD can influence the rest of the market. If other logic, GPU, AI accelerator, or ASIC companies adopt similar hybrid-bonded cache, memory, or chip structures, Adeia can use the AMD license as a precedent in negotiations or lawsuits.

COMMERCIAL IMPLICATIONS FOR $ADEA

The commercial implication is that Adeia’s hybrid-bonding story is still early, but rapidly becoming increasingly significant. The company reported $26 million of semiconductor revenue in 2025, up +40% from $18 million in 2024, and management directly tied that growth to 3D NAND adoption and strategic semiconductor licensing. Adeia has repeatedly said on multiple earnings calls and investor presentations that hybrid bonding specifically is a key driver of semiconductor deal flow.

In Q1 2026, the newly signed AMD agreement made AMD a greater-than-10% customer for the quarter, partly because of retroactive royalties. The conclusion to make from that is that one additional large logic or memory license can move results materially.

Because Adeia is primarily a licensing company rather than an equipment vendor, even a small number of additional logic or memory licenses can have outsized P&L impact. That creates genuine asymmetry for ADEA equity.

If hybrid bonding becomes standard not only in NAND but also more broadly in HBM, AI accelerators, and logic chips, which management itself tied to public roadmaps from Intel, Broadcom, and Marvell, along with large industry investments by Micron, Samsung, and SK Hynix, then Adeia does not need dozens of wins for the semiconductor segment to become strategically important. It only needs a handful of large, recurring deals.


Summary: Bullish VPG; characterizes it as one of the strongest stocks on the market.

@ShawnUn73811361 It's turning into one of the strongest stocks on the market

@stocktalkweekly I wish VPG would pull back so my shares don’t get called away 😂


Summary: Still holding VIAV as largest portfolio position since $13 entry last October.

@kiantrades Been my largest position since last October @ $13 entry, still is the largest weighting in the portfolio...

$VIAV set up still intact https://t.co/MQ0mc8Jfhc


Summary: Goldman initiates TWLO Buy with $300 PT (63% upside), citing AI/agentic tailwinds for communications infrastructure.

Goldman Sachs initiates coverage on Twilio $TWLO at 'Buy', with a $300 price-target:

"We initiate coverage of Twilio (TWLO) with a Buy rating and a 12-month price target of $300 (63% upside from current trading price).

We see Twilio as well positioned to benefit from increased developer activity as agentic builders still require communications infrastructure to reach end users (at the 2025 investor day, Twilio disclosed that 50% of the Forbes 50 AI startups were paying customers of Twilio as of 9/30/24).

This is primarily visible in Twilio’s self-service business (grew 28% YoY in 4Q25) and in Twilio’s Voice business (grew 20% YoY in 1Q26).

We believe investors will increasingly focus on 1) sustained gross profit growth acceleration and the durability of AI as a tailwind, 2) the trajectory of gross margins, & 3) how to underwrite positive risk/reward given extended valuation vs. history."


Summary: Still holding a long position in TE despite volatility.

@Fibonacci89 Very volatile stock, part of the game. I'm still long.

@stocktalkweekly What is your take on the $TE move today?


Summary: Five stocks joining the Nasdaq-100, implying index-inclusion buying pressure for all five names.

*NEBIUS TO JOIN NASDAQ-100 $NBIS

---

The following four names will also join the Nasdaq-100:

$ALAB Astera Labs

$RKLB Rocket Lab

$CRWV CoreWeave

$TER Teradyne


Summary: Excited bullish call on NBIS joining Nasdaq 100, targeting 10x upside.

@amitisinvesting LET'S GO NEBIUS !!! 10x BABY

https://t.co/rQ2qPBEl5a

NEW COMPANIES JUST ANNOUNCED TO JOIN THE NASDAQ 100 $QQQ:

$NBIS $RKLB $CRWV $TER $ALAB


Summary: Author discloses a live long position in T1 Energy ($TE) taken a few hours ago.

@spacanpanman @FuzzyPandaShort Long with you as of a few hours ago my friend 🫡

$TE: Gotta hand it to @FuzzyPandaShort, they're better than Jim Cramer's inverse calling ability

➡ The last time they issued a report on 5/19, T1 Energy ran 105% to $12.50

➡ This time will T1 Energy run 100% or 150% to $15 or $20?!?

Upside loaded and ready 🚀 https://t.co/9LTnYqGaA5


Summary: Shares/endorses Rosenblatt $180 PT on SYNA, citing Google Coral NPU partnership as core thesis.

Rosenblatt $180 PT on $SYNA this morning highlighted the same Google Coral NPU partnership that I discussed in my original thesis below.

Ahead of the herd...


Summary: Holding long calls in VPG and plans to exercise them in a few weeks, signaling continued bullish conviction.

Another new all time high for $VPG

I will be exercising these calls in a few weeks. https://t.co/M15svF1Zz2